PC Covestro 2805
PC Covestro 2805
Material Introduction: PC Covestro 2805 is a widely‑used medium‑viscosity general‑purpose polycarbonate material. It is well‑received for balanced mechanical properties, high transparency, favorable processability (with mold‑release agent) and food‑contact compliance.
Main Applications
- Electronic & Electrical Components: Electrical accessories and fittings.
- Automotive Parts: Automotive components, lamp housings, instrument panels, etc.
- Consumer Goods & General‑Purpose Parts: Toys, models, tableware (food‑grade certified), LED lamp housings, mobile phone housings and other products.
- Industrial Equipment & Parts: Protective covers and frames for mechanical equipment.
- Optical Lighting: Large‑size lamp housings, protective glazings.
Key Characteristics
| Characteristic Category | Description | Reference Data (Test Standard) |
|---|---|---|
| Physical Properties | Medium‑viscosity, high flowability, easy‑release | MVR: 9.0 cm³/10min (300°C/1.2kg, ISO 1133) Density: 1.20 g/cm³ (23°C, ISO 1183) |
| Mechanical Properties | Good rigidity and strength, excellent impact toughness | Tensile Modulus: 2400 MPa (23°C, ISO 527‑2/1) Charpy Notched Impact Strength: 70 kJ/m² (data from internet; exact value unavailable from other sources) |
| Thermal Properties | Good heat resistance | HDT (1.8 MPa): 125°C (alternative source: 137°C; Vicat Softening Temperature B50: 145°C) |
| Optical Properties | High transparency | Light Transmittance: 89% (1000μm, ISO 13468‑2) |
| Safety & Certifications | Food‑grade (FDA‑approved), UL certification (HB & V‑2 grade), RoHS compliant | ‑ |
| Processing Properties | Injection‑molding grade; sufficient pre‑drying required to prevent hydrolytic degradation | Recommended moisture content ＜0.02% |
Injection Molding Processing Parameters
| Processing Stage | Parameter Item | Suggested Range / Operation Notes | Unit / Remarks |
|---|---|---|---|
| Pre‑drying | Drying Temperature | 110‑120 | °C |
| Drying Time | More than 4 hours (extend as required) | h | |
| Allowable Moisture Content | ＜ 0.02% | Critical requirement | |
| Injection Temperature | Rear Barrel Temperature | 250‑260 | °C |
| Middle Barrel Temperature | 270‑280 | °C | |
| Front Barrel Temperature | 280‑290 | °C | |
| Nozzle Temperature | 270‑300 | °C | |
| Melt Temperature | 270‑320 (do not exceed 320°C) | °C (actual processing temperature shall be confirmed by air‑shot test) | |
| Mold Temperature | 80‑100 | °C (higher mold temperature reduces internal stress and improves filling & surface appearance) | |
| Injection Settings | Injection Pressure | 80‑150 | MPa (avoid excessive pressure which increases internal stress) |
| Holding Pressure | 40%‑60% of injection pressure | MPa | |
| Back Pressure | 0.5‑1.0 | MPa (beneficial for melt homogenization; excessive value may cause over high shear heat) | |
| Screw Speed | 40‑70 | rpm | |
| Others | Injection Speed | Relatively fast injection speed commonly adopted (e.g. electrical switch parts); slow‑to‑fast injection profile is typical | ‑ |
Disclaimer: All above data is for reference only.
